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描述
FA Systems has been constantly seeking new technological breakthroughs and innovations over the years to provide better systems and solutions to customers while cutting down costs. FA Systems has conceived, developed, designed, and successfully realized the next-generation Silicon Ingot Wire-Saw Equipment, which is used in the Solar Industry for slicing of ingots into wafers. The result is a brand new system that can slice silicon ingots into ultra-thin wafers so as to significantly reduce the total cost of solar photovoltaic (PV) panel manufacturing |
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Brand New Diamond Wire Wafering Saw FASA DWS-1336