Copper Bonding Wires

Copper bonding wires have a high purity Cu matrix and achieve their excellent processing properties by means of defined addition elements. They distinguish themselves by stable mechanical properties and the high reliability of the bonding joint, in particular as regards the reduced formation of intermetallic phases in comparison with the usual Au-Al system.
They are excellent for bonding with the ball / wedge process when using a reducing protective gas atmosphere. Processing is also possible in the wedge / wedge bonding process. Copper bonding wires are, therefore, both technically and economically an alternative to gold wires. A packaging concept tailor-made for Cu wires ensures that even after storage times of up to six months the wires can be readily processed.