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描述
The new epoxy Die Bonder 2100 xP is the most flexible 300 mm high speed platform, capable of running the full range of epoxy die attach applications such as QFN, TSOP, QFP, BGA, CSP-BGA, SiP-BGA, FBGA and LGA. It is the is the most effortless system to run, assist and control production resulting in a quantum leap in throughput and yield at the lowest cost of ownership. This innovative platform was awarded with the prestigious Swiss Technology Award in 2008.
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Esec 2100 xP Die Bonder