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Esec 2100 xP Die Bonder 购买在 新加坡 (首都)
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购买 Esec 2100 xP Die Bonder
Esec 2100 xP Die Bonder

Esec 2100 xP Die Bonder

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新加坡, 新加坡 (首都)
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描述

The new epoxy Die Bonder 2100 xP is the most flexible 300 mm high speed platform, capable of running the full range of epoxy die attach applications such as QFN, TSOP, QFP, BGA, CSP-BGA, SiP-BGA, FBGA and LGA. It is the is the most effortless system to run, assist and control production resulting in a quantum leap in throughput and yield at the lowest cost of ownership. This innovative platform was awarded with the prestigious Swiss Technology Award in 2008.

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Esec 2100 xP Die Bonder
Esec 2100 xP Die Bonder
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