Esec Wire Bonder 3200 SC

Today's market proven Esec Wire Bonder 3200 SC is widely received by the world's major Smart Card Technology leaders. The Wire Bonder 3200 SC has enabled the smart card packaging requirement to the next level with stable wire bonding process capabilities, stringent wire looping requirement and optimal yield throughput. With a market share of more than 90% Esec is not only the market leader, but also sets again the industry standard.