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Z-Pattern© on Esec Die Bonder 2100 购买在 新加坡 (首都)
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购买 Z-Pattern© on Esec Die Bonder 2100
Z-Pattern© on Esec Die Bonder 2100

Z-Pattern© on Esec Die Bonder 2100

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描述

As the first in the industry, Esec introduces the Z-Pattern© for small die bonding in the range of 0.8-1.5 mm, achieving unbeatable UPH rates. The new process combines the strengths of both, the process quality of a cross pattern with the UPH performance of a single dot with the process quality of the cross pattern.

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Z-Pattern© on Esec Die Bonder 2100
Z-Pattern© on Esec Die Bonder 2100
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