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描述
As the first in the industry, Esec introduces the Z-Pattern© for small die bonding in the range of 0.8-1.5 mm, achieving unbeatable UPH rates. The new process combines the strengths of both, the process quality of a cross pattern with the UPH performance of a single dot with the process quality of the cross pattern.
联系卖家
Z-Pattern© on Esec Die Bonder 2100